This is a system that applies clean robots.

300mm wafers are transported one by one to cassettes (containers) A to B.

Compatible cassettes (containers) are FOUP, FOSB, OPEN, and PFA.

The standard transport is in units of 1 sheet, but transport in units of 5 or 25 sheets is also available.

Wafers can be safely transported collectively between cassettes.

Since wafers are lifted from the cassette for loading/unloading, contact with the cassette is minimized to prevent wear, dust generation, and damage to the wafer edge. Wafer mapping detects loading errors such as wafer misalignment and double stacking. With erroneous operation prevention sensor and emergency stop button.

• Space saving
• Anti-static type
• Error monitoring with optical and mechanical sensors
• with mapping sensor
• Compatible with FOUP・FOSB・H-Square metal cassettes
• Class 10 clean room compatible

Want to transport wafers easily.

Want to suppress the rubbing of the workpiece in the cassette.

Number of cassette stages, automation, work size, etc.

1. Case used by equipment manufacturers① Wafers for evaluation are provided by device manufacturers in FOSB (shipping cases).
   ② Transfer to a carrier (for example, FOUP) used in the equipment manufacturer's system.
   ③ Transfer the wafer after evaluation to the FOSB. (returned to device manufacturer).
   Equipment manufacturer exampleEtching equipment, ashing equipment, cleaning equipment, coater developer, exposure equipment, etc.
2. Case used by wafer makers① Transfer completed wafers (after completion of final cleaning and inspection) to FOSB (shipping case).
   ② Transfer to PFA carrier (cleaning carrier) between processes (cleaning process, etc.).