12″ compatible single-wafer quartz glass wafer transfer equipment

This device is φ300mm (12") quartz glass wafer stage ① ~Stage ② This is a system that automatically transfers single wafers between carriers.

The cassette used is a FOUP・FOB carrier.

Basically the carrier sets the stage to the stage.

Air cleanliness: ISO class3 (iso-14644)

1. Wafer	φ300mm　Quartz glass notch Diameter　φ300mm ± 0.2mm Thickness　400～700μm Warp　40μm or less Contact range　Wafer back

2. Career	Auto door FOSB　　　Type　designation FOUP　　　　　　　　 Type　designation Wafer pitch　　　　 10mm

Please refer to the attached drawings.

Each specification (1)

Stage 1（loader）

Device front left stage
Carrier
- ① Auto door FOSB　 Wafer storage pitch × 25
- ② FOUP　SEMI standard　Wafer pitch 10mm × 25
Sensor function
- ① A transmission mapping sensor for confirming wafer load in the cassette is installed.

Stage 2（Unloader）

Device front right stage
Carrier
- ① Auto door FOSB　Wafer pitch 10mm × 25
- ② FOUP　SEMI Standard　Wafer pitch 10mm × 25
Sensor function
- ① Install a transmissive mapping sensor for checking the presence of wafers in the cassette.

Wafer transfer robot

Movement Telescopic, rotating, vertical 3-axis robot (servo motor drive)
Robot hand CFRP wafer contact part PEEK edge hold method
Wafer transfer specifications　Basically, the process is from the lower part of the cassette to removal → upper stage to storage.
Parallel transfer/extraction is also possible.